AMKOR and IMEC SIGN COLLABORATION AGREEMENT FOR 3D WAFER-LEVEL PACKAGING
July 17th, 2007 Leave a comment Visited 46 times, 4 so far today
AMKOR and IMEC SIGN COLLABORATION AGREEMENT FOR 3D WAFER-LEVEL PACKAGING
SEMICON WEST – JULY 17-19, 2007 – MOSCONE CENTER, SOUTH HALL, IMEC BOOTH #1846
CHANDLER, ARIZONA AND Leuven, Belgium – July 16, 2007 – Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, Europe’s leading independent nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.
“This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers”, said Dan Mis, Amkor’s Senior Vice President for Wafer Level Advanced Product Development.
Luc Van den hove, IMEC’s Executive Vice President and Chief Operating Officer, commented: “We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level.”
About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s web site: www.amkor.com.
About IMEC
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. Its research focuses on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network of companies, universities and research institutes worldwide position IMEC as a key partner for shaping technologies for future systems.
IMEC is headquartered in Leuven, Belgium, has a sister company in the Netherlands, IMEC Nederland, concentrating on wireless autonomous transducer solutions, and has representatives in the US, China and Japan. Its staff of more than 1500 people includes more than 500 industrial residents and guest researchers. In 2006, its revenue (P&L) was EUR 227 million. Further information on IMEC can be found at www.imec.be.
Contacts:
Amkor Technology, Inc.: Gil Tily, Corporate Vice President and General Counsel, +1 480 821 5000 ext. 5162
IMEC: Katrien Marent, IMEC Corporate Communications, T: +32 16 28 18 80, katrien.marent {at} imec(.)be
For IMEC : Barbara Kalkis, Maestro Marketing & PR, T : 1 408 996 9975, kkalkis {at} compuserve(.)com
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