VIA Unveils Cluster Server Platform for Ultra High Density Servers

VIA Unveils Cluster Server Platform for Ultra High Density Servers

New Delhi October 20, 2005 Chip maker VIA Technologies has launched its energy saving VIA Cluster Server Platform powered by the dual VIA Eden-N processor-based Mini-ITX motherboards.

The VIA Cluster Server Platform reference design comprises of low profile 1U units each with two VIA VT310-DP Mini-ITX mainboards, enabling each 1U unit to operate as two individual server nodes. The reference design leverages the power-performance ratio and thermal properties of the fanless 1 GHz VIA Eden-N processors to draw up to a very low 1 kilowatt from a standard AC power outlet.

“The ever-increasing demand for processing power in education, business and other organizations that are increasingly cost, space and power conscious has generated a need for more innovative high density server solutions,” said Eric Chang, Special Assistant to the CEO, Strategic Marketing, VIA Technologies Inc. “Our energy efficient, cost effective Cluster Server Platform packs a powerful processing punch into a really small space, putting massively parallel computing into the hands of whole new markets.”

The new cluster server permits two 3.5″ IDE/SATA hard drives to be installed with the mainboards, enabling high density local storage for applications such as data mining. Combined with relevant middleware, the reference design is said to empower all cluster configurations, including high performance, high availability and load balancing designs.

The company said that through the ultra low power consumption of VIA VT310-DP Mini-ITX mainboards, the VIA Cluster Server Platform enables high density server solutions that require no power or cooling infrastructure changes, and also makes redundant the need for system and processor fans for near-silent operation, bringing the benefits of a cluster server solution without the traditional high implementation, operation and maintenance costs.