New IBM Technology Enables Single-Chip Mobile Solutions

At the annual FSA Suppliers Expo and Conference, IBM (NYSE: IBM) today announced the introduction of a new semiconductor technology designed for mobile handset and wireless technology markets. This new offering will enable chipset providers for mobile devices to further reduce the complexity of their components — representing a significant savings in manufacturing costs for the next generation of mobile phones, laptops and other portable communication devices.

This new semiconductor technology — named CMOS 7RF SOI — is designed to enable single-chip Radio Frequency (RF) solutions by integrating the multiple RF/analog functions of today’s handsets — such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers — into single-chip solutions for mobile devices. Single-chip solutions address the need for fully integrated multimedia functionality on low-cost handsets, providing entry-level users in emerging markets such as China, India and Latin America with affordable, power-efficient and high-performance mobile devices.

As this technology evolves, it could create additional integration opportunities that include filter, power amplifier, power management and receiver/transmitter functions — the types of integration possibilities that are cost-prohibitive or technically unfeasible with semiconductor technology used in mobile devices today. Supporting this integration pathway is an array of IBM engineering and go-to-marketing services that will help clients solve challenges related to component design and manufacturing.

“CMOS 7RF SOI is yet another example of how we deliver advanced, cost-effective features for integration and performance that are new to both our clients and the industry,” said Steve Longoria, vice president for Semiconductor Solutions, IBM Global Engineering Solutions. “Our clients can turn to IBM for lower cost solutions, with the assurance of a stable technology base founded on our years of experience in manufacturing CMOS, RF CMOS and silicon germanium technologies.”

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