Dongbu HiTek Targets China’s Growing Mobile Phone Market

Advanced CMOS Image Sensor (CIS) Chips and Modules to Be Showcased at the International IC China Trade Show Opening March 3rd in Shenzhen
IIC-China Conference & Exhibition 2008

Dongbu HiTek (KSE:000990) today confirmed that it will showcase its latest VGA, 1.3 and 2.0 megapixel CMOS Image Sensor (CIS) chips and camera phone modules at the International IC China (IIC China) trade show, which opens in Shenzhen on March 3, 2008. Dongbu HiTek’s IIC China participation highlights the Korean company’s strategic initiatives to capture a strong position in China’s rapidly growing mobile phone market.

China has fast become the global hub for mobile phone manufacturing, currently accounting for about half of all units shipped worldwide. During 2007, the sales of Chinese manufactured mobile phones exceeded 100 units. By some estimates, this number is expected to reach 125 million units by 2010.

During the IIC China event, Dongbu HiTek executives will be meeting with the executives from China’s leading mobile handset developers including Mobile Innovation Chip Technology Ltd. and Ginwave Technologies. In-depth discussions are expected to address key product development and marketing objectives.

Dongbu HiTek formally launched its aggressive program to serve Chinese mobile handset OEMs this past July when it established a Shenzhen sales subsidiary and simultaneously entered into a strategic partnership with China based HNT Co., Ltd., a camera module manufacturer. The HNT partnership is expected to expand Dongbu HiTek’s monthly capacity to produce camera modules by approximately 1 million units, while also ensuring a stable supply to Chinese OEMs. This synergistic partnership is also expected to drive further enhancements in quality management and timely delivery as it deploys a comprehensive production system that encompasses design, production, test, packaging and module manufacturing.

“Our focus on developing competitive, high quality CIS chips and camera modules will continue to intensify over the course of 2008,” stated Hae-Soo Jeong, Dongbu HiTek Senior EVP. “We anticipate signing contracts with large customers based on our exceptionally stable and comprehensive production system.” He underscored his company’s commitment to add high value across a wide range of CIS applications. “Our CIS product roadmap includes next-generation chips and modules that will serve applications beyond camera phones, such as automobile rearview cameras and surveillance cameras.”

About Dongbu HiTek

Headquartered in Seoul, Korea, Dongbu HiTek Co., Ltd. offers advanced products and services across three major business areas: Agriculture, Materials and Semiconductor. The Semiconductor Business provides specialized proprietary chips and modules as well as foundry services that add high value to display, mobile and various analog applications. The company’s two world-class fabs currently process 200mm wafers at nodes ranging from 0.35 microns to 110 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development/verification, and packaging/module development. The Semiconductor Business specializes in developing best-in-class CMOS Image Sensor (CIS) and Display Driver IC (DDI) chips as well as chips that incorporate either High Voltage or Flash memory functions. Dongbu HiTek’s stock is publicly traded under 000990 on the Korea Stock Exchange. For more information, visit www.dongbuhitek.com.

Contacts

Dongbu HiTek HQ
Kevin Lee, +82.17.337.4698
kevin.lee {at} dongbu(.)com
or
for Dongbu HiTek USA/ Europe
Elizabeth Estrella-Basilio, +1-408-238-8822
elizabeth {at} crossborderpr(.)com