AMD Releases Integrated Hardware And Software Design Solution

AMD Releases Integrated Hardware And Software Design Solution

AMD (NYSE: AMD) today announced availability of the first development board specifically designed for the high-performance, low-power AMD Geodeâ„¢ NX processor family, featuring the Mini-ITX form factor and a specialized Silicon Integrated Systems (SiS) chipset. The AMD Geodeâ„¢ NX DB1500 development board and reference design was created to simplify product design processes with integrated hardware and software capabilities using high-performance, low-power Geode NX processors. Customers can use the AMD Geode NX DB1500 to develop small form factor devices including thin-client, point-of-sale, or single-board computers or other embedded applications, including entertainment and gaming systems, with outstanding x86 processor performance.

The turnkey development board and design solution from AMD combines a processor, chipset, memory and peripherals together on a single platform along with debugging features and software. Deployed in Microsoft® Windows® XP/XPe, Windows CE.net and Linux operating system environments, and designed to be compatible with a vast array of x86 applications and solutions, the NX DB1500 development board suits the design demands of customers in a multitude of embedded environments.

Using the reference design kit and development platform offered by AMD, design engineers save time during the design and test process, allowing for more resources to be focused on feature and design enhancements.

“Logic is excited to partner with AMD and SiS to provide a development board and single-board computer that reduces time to market for customers seeking low-power, high-performance embedded solutions,” said Eric Harnisch, director of marketing, Logic Product Development. “The AMD Geode NX processor enables Logic to provide customers with a product-ready, low-power, fanless single-board computer that can be immediately integrated into their product. The board was designed to meet the demands of numerous power- and heat-sensitive environments.”

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