Sound Design Technologies Launches INSPIRIA™ Ultimate DSP for Hearing Aids

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April 7th, 2008 Leave a comment Visited 31 times, 1 so far today

Sound Design Technologies (SDT), a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, announces the launch of INSPIRIA™ Ultimate DSP for hearing aids, which will be unveiled during AudiologyNOW! 2008 in Charlotte, North Carolina.

INSPIRIA™ Ultimate is a premium DSP product offering outstanding sound quality and versatile functionality. INSPIRIA™ Ultimate features: iLog™ Datalogging, automatic Adaptive Directional Microphones (ADM), Advanced Feedback Cancellation (FBC 3.0) with up to 30 dB of Added Stable Gain, unparalleled 128-band Adaptive Noise Reduction (ANR3.1), 16-bands of graphic equalization and the superior 20-bit wide bandwidth (up to 16 kHz) sound quality of the VOYAGEURII™ DSP platform, delivering unprecedented sound quality, comfort and audibility to hearing aid wearers.

“With INSPIRIA™ Ultimate we’ve developed a product that offers a significant leap in performance and functionality and in conjunction with ARKonline® customization available on our brand new website, enables our hearing aid customers to expediently deploy the benefits of this product into their next generation product releases”, says Dan Carlson –Vice President of Sales and Business Development at SDT. “Our VOYAGUERII™ DSP platform has facilitated the extremely current efficient implementation seen on INSPIRIA™ Ultimate. This product can be used in all styles of hearing aids including the newly popular open-fit hearing instruments.”

INSPIRIA™ Ultimate is offered as a lead-free RoHS compliant part in SDT’s miniaturized thinSTAX® VOYAGEURII™ hybrid. The extremely small form factor of the product ( 0.215 x 0.124 x 0.067 in3 OR 5.46 x 3.15 x 1.70mm3 ) allows manufacturers to build hearing aids of all form-factors including CIC, ITE, BTE, and mini-BTE styles. Samples are available now, with full production quantities available in May 2008.

For additional information on this product, please visit www.sounddesigntechnologies.com, or contact your sales representative.

About Sound Design Technologies:

Sound Design Technologies is a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, and a leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP). Founded in 2007 via the acquisition of Gennum Corporation’s Audio Division and Manufacturing Operations, Sound Design Technologies is headquartered in Burlington, Ontario, with additional offices in Ottawa. Additional information is available at: www.sounddesigntechnologies.com.

Contacts

Sound Design Technologies
Shailja Tewari, 905.635.0804 Ext. 2870
stewari {at} sounddes(.)com





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