SiS to be Invited to Participate in DTF 2007 Embedded World

SiS to be Invited to Participate in DTF 2007 Embedded World

SiS today presented its latest technology to embrace the upcoming world of embedded systems by participating in DTF 2007 Embedded World. With the speech topic of “Delivering High-Performance & Low-Power Embedded x86 Chipset Solutions,” SiS showed off its achievements of developing chipsets for the embedded systems.

DTF 2007 was held on Jan. 24th at The Westin Taipei. This year, the forum is co-held by Digitimes, Technology IT Weekly, and National SoC Program Office. SiS, as a successful chipset innovator, has the honor of being invited to make the speech of sharing its valuable experiences in developing the embedded systems. In the meantime, SiS presented its achievements to visitors by displaying partners’ products which successfully adopt SiS embedded chipsets. Displays range from Thin Clients, IPC mainboards, Eagle III platforms, and Server Boards.

SiS is well-experienced in innovating solutions for Desktop PCs and Notebook PCs. With the accumulated technology and know-how, SiS is easy to get involved in the embedded system field. For years, SiS has been co-developing extensive consumer electronics products covering Billboard, Thin Client, Tablet PC, Set-Top-Box, and etc. with worldwide leading manufactures such as Samsung, Fujitsu Siemens, HP…..and so on. In DTF 2007, SiS delivers its vision of digital home entertainment with the speech topic of “Delivering High-Performance & Low-Power Embedded x86 Chipset Solutions.”

The SiS741CX chipset, specially designed to support AMD platform and AMD Geode™ NX series processors, has been successfully implemented in Samsung 40’Multi-Function Monitor. Other than this, SiS has been co-developed different applications of the SiS741CX chipset with leading computer makers, such as HP and Fujitsu Siemens. The chipset is implemented in Thin Client, which is also displayed in DTF 2007.

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