AMD Promotes Raj N. Master to Corporate Fellow

AMD Promotes Raj N. Master to Corporate Fellow

AMD (NYSE: AMD) today announced the promotion of Raj N. Master to Corporate Fellow. In this role Master will focus on driving continued excellence in the performance and cost-effectiveness of AMD’s chip packaging technologies. Packaging is the final step in the semiconductor manufacturing process where a wafer is cut and packaged into an individual microprocessor. Master’s areas of expertise include C4 (controlled collapse chip connection), die packaging, assembly and thermal solutions within AMD’s expanding product portfolio.

Corporate Fellowship is the highest level of technical recognition at AMD, and is reserved for those who impact AMD’s business opportunities and technical breadth by providing a high degree of expertise, knowledge, creativity and tactical and strategic direction

“Raj Master is the kind of domain expert that makes AMD such a magnet for talent,” said Chuck Anderson, corporate vice president of manufacturing services at AMD. “Through Raj’s leadership and commitment we took the C4 process and implemented it with tremendous speed, accuracy and agility in our facilities in Europe and Asia to meet the growing needs of our business.”

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