Quantum Leap Packaging Appoints Fritz Johnson VP of Business Development

Quantum Leap Packaging Appoints Fritz Johnson VP of Business Development

Quantum Leap Packaging, Inc. (QLP) a leading provider of high-performance semiconductor packaging utilizing Quantech™ proprietary polymers, is pleased to announce the appointment of Fritz Johnson as Vice President of Business Development.

“QLP is now poised for major growth, and we expect that Fritz with his extensive knowledge and experience in semiconductor packaging, particularly the laminate and organic substrate business will be a valued asset on our team,” said CEO David Grooms. “Fritz will make an immediate impact and further strengthen our position in the semi-conductor packaging industry and help solidify our goal of expansion around the globe. The appointment will have significant impact on QLP’s growth.”

Johnson has over 18 years experience in the IC packaging and assembly materials industry, with senior sales and product management positions at Kyocera America Inc., Johnson Matthey Electronics, and Sumitomo Bakelite. In addition to his semiconductor background, Johnson lived in Japan for several years and speaks fluent Japanese. Johnson has a Masters in International Management from the Thunderbird School of Global Management and a BA in International Studies from the University of the Pacific.

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. (QLP) designs and manufactures high performance hermetic and near-hermetic air cavity packages for semiconductor packaging, in applications such as Image Sensors, MEMs, Power Amplifiers and RF-Microwave devices. Utilizing injection mold technology and Quantech™, a proprietary polymer that can be tailored to meet specific properties, QLP offers a variety of package configurations such as QFN and LDMOS packages including custom designs that improve reliability and operating performance.

QLP has developed HermeTech™, the industry’s first true plastic hermetic package in a design and manufacturing breakthrough long sought by the industry. The breakthrough was made possible by the combination of QLP’s innovative Quantech™ material, engineering design, and proprietary process technology.

For more information, please refer to www.qlpkg.com
Contacts

Quantum Leap Packaging, Inc.
Chris Lee, 978-253-6153
clee {at} qlpkg(.)com
www.qlpkg.com