World’s first parallel 2-D/3-D inspection with Siplace OS

World’s first parallel 2-D/3-D inspection with Siplace OS

Siemens Automation and Drives (A&D) is adding the new Siplace OS inline inspection system to its portfolio of Siplace SMT solutions. The Siplace OS is the world’s first inspection system to combine two-dimensional and three-dimensional inspection technologies. The benefit: significantly reduced setup times. Based on the 3-D measurements and the package shape library that does not depend on specific component variants, new products can be introduced much more quickly than before. The Siplace OS can be positioned anywhere on the line (post-paste, pre- and post-reflow as well as in mixed mode) and ensures error-free, fully documented quality.

As electronic modules are becoming more complex, components and solder pads smaller and the population density greater, the quality requirements in the electronics industry are becoming increasingly tougher. With the help of Siplace OS, manufacturers can now execute their process control and automatic inspection activities on the factory floor quickly and with exceptional precision.

The new Siplace OS is a fully automated high-speed machine for automated optical inspection (AOI). Using the 3-D triangulation method, it checks anything that can inspect optically inline and without slowing down the production line: the solder paste application including area, volume, shape and position; the correct positioning of components including their polarity; and the finished product after it exits the reflow oven. Depending on the user’s individual needs, the Siplace OS inspection system can be adapted to any process requirements since it can be employed anywhere on the line.

The 3-D triangulation operates particularly fast and carries out 2-D and 3-D height measurements simultaneously. The 3-D measurements are performed across the entire board surface, which sets the Siplace OS apart from other systems that perform a slow, cumbersome extra step that requires a laser. The triangulation method produces a precise topography of the test subject. Thanks to its permanent 3-D recognition, the system is unaffected by different component colors or board colors. For each package shape, only a single description is needed, which makes time-consuming re-teaching after product changeovers unnecessary and reduces the time required for new product introductions to a minimum.

Read the complete Press Release