AirLive, one of the most advanced and worldwide brands for networking and communication equipments, introduced AirCam POE-200HD one of the newest accessions to the AirLive IP Camera family. AirLive AirCam POE-200HD is a high tech 1.3 megapixel CMOS network camera designed for professional indoor surveillance and security applications. Megapixel resolution offers a huge jump [...]

Professional digital SLR with the newly designed FX-format CMOS image sensor and HD movie capability, delivering improved ultra-high sensitivity, image quality and response speed.
Nikon Corporation is pleased to announce the introduction of its newest FX-format digital SLR flagship for fast response and high light sensitivity: the Nikon D3S.
Standing on the shoulders of the world-renowned D3, [...]

Leuven, Belgium – October 5, 2009 – IMEC launches the industrial affiliation program (IIAP) INSITE or Integrated Solutions for Technology Exploration. INSITE is a framework of design exploration modules that allows fables and fablite companies, foundries and EDA vendors to develop design and product information using emerging IC process technologies 1 to 3 generations ahead [...]

New Executive Leadership Increases Focus on Aptina’s Image Sensor Business in Japan

Aptina announced today the appointment of Greg Helton to President and Managing Director of Aptina Japan. Helton is the first appointment to this role and will be responsible for directing Aptina’s overall business, marketing and sales support services in Japan.
“Greg is a great [...]

Side-by-side LDO regulator stages are engaged depending on load requirements — 20 µA, max power consumption in high-speed mode, 2 µA, max in power-save mode; features include operation from input as low as 1.7 V; integrated output discharge function, inrush current, over-temperature and over-current protection
ROHM Semiconductor has introduced a new series of CMOS LDO [...]

Leuven, Belgium – July 14, 2009 – IMEC has achieved promising results in the race to scale CMOS to 22nm and below. The breakthroughs from its transistor scaling programs include a successful integration of the laser-anneal technique in a high-K/metal-gate first process and a step forward towards fabricating aggressively scaled germanium-pFET transistors.
To scale CMOS technology [...]

Applied Materials, Inc. today introduced its Applied Charger™ UBM PVD system that defines a new standard in metal deposition productivity and reliability for chip packaging. Specifically designed for under-bump metallization (UBM), redistribution layer and CMOS image sensor applications, the Charger system’s new linear architecture more than doubles the wafer output of competing systems to deliver [...]

LEUVEN, BELGIUM – APRIL 22, 2009 – Today, IMEC presented the world’s first
functional 22nm CMOS SRAM cells made using EUV lithography. The 0.099µm²
SRAM cells are made with FinFETs and have both the contact and metal1 layer
printed using ASML’s full field extreme ultraviolet (EUV) Alpha Demo Tool
(ADT). The ultra-small circuit structures were made using Applied
Material’s most [...]

LEUVEN, BELGIUM – APRIL 7, 2009 – IMEC, the Belgian nanoelectronics
research institute, has announced that it has begun expanding its Leuven
campus facilities, starting with 2,800 square-meters of research labs and
including the extension of its state-of-the-art clean room. With this
extension, IMEC will expand its research on sub-32nm CMOS, low-cost and
high-efficiency solar cells, and [...]

Kulim, Malaysia (April 2nd , 2009) – SilTerra Malaysia Sdn. Bhd., a leading wafer foundry provider, officially received the 2009 South East Asia Technology Implementation Award from Frost & Sullivan, an independent industrial research and consulting firm. The award is a timely recognition and endorsement of SilTerra’s leadership and accomplishment in our engineering and [...]