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Toshiba Achieves Higher Hole Mobility for Future Generation CMOS Technology by Twisted Direct Silicon Bonding Technology

VLSI Symposia 2008
Toshiba Corporation (TOKYO:6502) today announced that, together with IBM Corporation, it has developed a higher performance CMOS FET, a high priority for advanced system LSI. The new technology matches the highest possible performance, and opens the way for further advances in process technology. Toshiba and IBM announced the achievement on June 19, at [...]

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