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Toshiba Develops a New High-k/Ge Gate Stack Technology for LSIs at 16 Nanometers (nm) Node and Beyond

– Achieved a Record-High Hole Mobility by Forming an Ultra-Thin Strontium Germanide (SrGex) Interlayer —
Toshiba Corporation (TOKYO:6052) today announced a significant advance in the development of a gate stack and interlayer with high carrier mobility that can be applied to advanced metal-insulator-semiconductor field-effect transistors (MISFETs) in future generations of LSIs.
The ultra-thin, Equivalent Oxide [...]

Toshiba Achieves Higher Hole Mobility for Future Generation CMOS Technology by Twisted Direct Silicon Bonding Technology

VLSI Symposia 2008
Toshiba Corporation (TOKYO:6502) today announced that, together with IBM Corporation, it has developed a higher performance CMOS FET, a high priority for advanced system LSI. The new technology matches the highest possible performance, and opens the way for further advances in process technology. Toshiba and IBM announced the achievement on June 19, at [...]

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